Elite Gen 6 vs Extreme Gen 6 — memory differences
TrendForce methodology notes
Spot session averages are transactional board prints (USD/die), not finished module retail. Contract QoQ bands are forward survey ranges for conventional DRAM and NAND Flash in 3Q26. This desk converts die averages into BOM line estimates with explicit packaging and density factors — useful for comparing builds, not for quoting a purchase order.
TrendForce DRAM spot · 3Q26 contract outlook
How phone BOM memory lines work
OEMs buy LPDDR packages and UFS in capacity bins. During a shortage, spot boards for PC DRAM move first; mobile contract follows with a lag. Raising a phone from 12GB to 16GB is not just “+33% RAM cost” — die count, package type (LPDDR5X vs LPDDR6), and yield bins all shift the line. DramDesk shows that line so you can see the tax before the MSRP lands.
Glossary
- Session average
- Mean of prints in a TrendForce spot trading session for a named die.
- eTT
- Enhanced tested / lower-bin dice — cheaper, wider variance, common in gray channels.
- QoQ contract band
- Surveyed quarter-over-quarter % change OEMs expect to pay on contract.
- Memory tax
- Estimated DRAM + NAND contribution to a build’s BOM at current elevated levels vs a calmer baseline.
- LPDDR6
- Next mobile DRAM standard; Extreme Gen 6 unlocks it (up to 24GB in coverage).
- UFS 5.0
- Next phone storage interface on Extreme; standard Gen 6 stays on UFS 4.1.
Embedded spot snapshot
| Item | Session avg (USD) | Δ session |
|---|
